Author:
Jun Yi Chuang ,Sung Pi Tseng ,Yeh J.A.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Bonding Wire Interconnects between MMIC for 5-GHz Intra/Inter-Chip Communications;2022 19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON);2022-05-24