Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy-Reference-Cited by-同舟云学术

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Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy

Published: Issue: Volume: Page:
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Container-title:53rd Electronic Components and Technology Conference, 2003. Proceedings.
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Author:

Pang J.H.L.,Xiong B.S.,Neo C.C.,Mang X.R.,Low T.H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8632/27358/01216355.pdf?arnumber=1216355

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2. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB);Journal of Electronic Materials;2020-11-05

3. State of the Art of Lead-Free Solder Joint Reliability;Journal of Electronic Packaging;2020-09-03

4. Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors;IEEE Transactions on Power Electronics;2020-09

5. Reliability Tests and Data Analyses of Solder Joints;Assembly and Reliability of Lead-Free Solder Joints;2020

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