Process and Packaging Innovations for Moore’s Law Continuation and Beyond-Reference-Cited by-同舟云学术

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Process and Packaging Innovations for Moore’s Law Continuation and Beyond

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE International Electron Devices Meeting (IEDM)
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Author:

Chau Robert

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8971803/8993428/08993462.pdf?arnumber=8993462

Cited by 67 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Type-III Van Der Waals Stacking Induced Ohmic Contacts: A Contact Strategy for 2-D Complementary Electronics;IEEE Transactions on Electron Devices;2023-11

2. Complementary Field-Effect Transistors: From Silicon to 2D Materials;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

3. Toward monolithic growth integration of nanowire electronics in 3D architecture: a review;Science China Information Sciences;2023-09-06

4. MOSFETs with Stacked 2D Nanosheet Channels – An Auspicious Option to Delay “Forever”;2023 37th Symposium on Microelectronics Technology and Devices (SBMicro);2023-08-28

5. The future transistors;Nature;2023-08-16

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