Process and Packaging Innovations for Moore’s Law Continuation and Beyond-Reference-Cited by-同舟云学术

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Process and Packaging Innovations for Moore’s Law Continuation and Beyond

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE International Electron Devices Meeting (IEDM)
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Author:

Chau Robert

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8971803/8993428/08993462.pdf?arnumber=8993462

Cited by 69 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer;IEEE Access;2024

3. Thermal management of high flux electronics using film evaporation with an enhanced fluid delivery system (FEEDS);International Communications in Heat and Mass Transfer;2023-11

4. Type-III Van Der Waals Stacking Induced Ohmic Contacts: A Contact Strategy for 2-D Complementary Electronics;IEEE Transactions on Electron Devices;2023-11

5. Complementary Field-Effect Transistors: From Silicon to 2D Materials;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

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