3D Multilayer Printing of 3D Multilayer Devices-Reference-Cited by-同舟云学术

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3D Multilayer Printing of 3D Multilayer Devices

Published:2023-06-21 Issue: Volume:50 Page:1-6
ISSN:
Container-title:2023 15th International Congress Mechatronic Integration Discourse (MID)
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Author:

Olsen Ejvind¹,Pflieger Keno¹,Evertz Andreas¹,Fütterer Laura¹,Overmeyer Ludger¹

Affiliation:

1. Leibniz University Hannover,Institute of Transport and Automation Technology,Hannover,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10461347/10461316/10461321.pdf?arnumber=10461321

Reference19 articles.

1. Räumliche elektronische Baugruppen (3D-MID)

2. Additive Manufacturing of 3D Multilayer Devices

3. Laser sintering of copper conductive traces on primer pre-treated additive manufactured 3D surfaces

4. Printing of laser-generated conductive copper tracks on 3D components

5. Additive manufacturing of copper vertical interconnect accesses by laser processing

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