Uncertainty Quantification of Signal Integrity Analysis for Neuromorphic Chips-Reference-Cited by-同舟云学术

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Uncertainty Quantification of Signal Integrity Analysis for Neuromorphic Chips

Published:2022 Issue: Volume:1 Page:160-169
ISSN:2768-1866
Container-title:IEEE Transactions on Signal and Power Integrity
language:
Short-container-title:IEEE Trans. Signal and Power Integr.

Author:

Ma Hanzhi¹^ORCID,Li Da¹^ORCID,Tao Tuomin¹,Shangguan Xingjian²^ORCID,Liu En-Xiao³^ORCID,Schutt-Aine Jose²,Cangellaris Andreas C.²,Li Er-Ping¹^ORCID

Affiliation:

1. College of Information Science and Electronic Engineering, ZJU-UIUC Institute, Zhejiang University, Hangzhou, China

2. Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA

3. A*STAR Institute of High Performance Computing, Singapore

Funder

National Natural Science Foundation of China

Zhejiang Laboratory Foundation of China

Zhejiang Provincial Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/9745882/9770004/09953562.pdf?arnumber=9953562

Reference27 articles.

1. Complementary resistive switches for passive nanocrossbar memories

2. Parasitic Effect Analysis in Memristor-Array-Based Neuromorphic Systems

3. Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

4. Circuit Modeling for RRAM-Based Neuromorphic Chip Crossbar Array With and Without Write-Verify Scheme

5. Modeling and Analysis of Passive Switching Crossbar Arrays

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stochastic Time-Domain Mapping for Comprehensive Uncertainty Assessment in Eye Diagrams;IEEE Transactions on Electromagnetic Compatibility;2023-12

2. Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

3. An Electromagnetic Perspective of Artificial Intelligence Neuromorphic Chips;Electromagnetic Science;2023-09

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