Decomposition characteristics of SF6 under thermal fault for temperatures below 400°C-Reference-Cited by-同舟云学术

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Decomposition characteristics of SF6 under thermal fault for temperatures below 400°C

Published:2014-06 Issue:3 Volume:21 Page:995-1004
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Zeng Fuping,Tang Ju,Fan Qingtao,Pan Jianyu,Zhang Xiaoxing,Yao Qiang,He Jianjun

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/6832230/06832242.pdf?arnumber=6832242

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