Integrated Sensing and Communications: Recent Advances and Ten Open Challenges

Author:

Lu Shihang1ORCID,Liu Fan1ORCID,Li Yunxin1ORCID,Zhang Kecheng1,Huang Hongjia2,Zou Jiaqi3ORCID,Li Xinyu4,Dong Yuxiang5ORCID,Dong Fuwang1ORCID,Zhu Jia3,Xiong Yifeng3ORCID,Yuan Weijie1ORCID,Cui Yuanhao1ORCID,Hanzo Lajos6ORCID

Affiliation:

1. School of System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen, China

2. Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hong Kong, China

3. School of Information and Communication Engineering, Beijing University of Posts and Telecommunications, Beijing, China

4. School of Information Science and Engineering, Southeast University, Nanjing, China

5. Collective Intelligence and Collaboration Laboratory, China North Artificial Intelligence and Innovation Research Institute, Beijing, China

6. School of Electronics and Computer Science, University of Southampton, Southampton, U.K.

Funder

National Natural Science Foundation of China

Special Funds for the Cultivation of Guangdong College Students’ Scientific and Technological Innovation “Climbing Program”

Shenzhen Science and Technology Program

Fundamental Research Funds for the Central Universities

Postdoctoral Innovation Talents Support Program

Jiangsu Planned Projects for Postdoctoral Research Fund

Natural Science Foundation of Guangdong Province

Shenzhen Key Laboratory of Robotics and Computer Vision

Engineering and Physical Sciences Research Council Projects

European Research Council’s Advanced Fellow Grant QuantCom

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

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