Material and Structure Designs for Reliable Quad-Flat-Package for Scaled-Down Ultralarge-Scale Integrations With Porous Low-$k/{\rm Cu}$ Interconnects
-
Published:2013-03
Issue:3
Volume:3
Page:384-390
-
ISSN:2156-3950
-
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
-
language:
-
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Tagami Masayoshi,Ito Fuminori,Inoue Naoya,Hayashi Yoshihiro
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. SIGNAL SENSING BY THE ARCHITECTURE OF EMBEDDED I/O PAD CIRCUITS;International Journal on Smart Sensing and Intelligent Systems;2014