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Yield and Electrical Functionality of the Glass-Laminated Conductive Wires and Connectors

  • Published:2019-12 Issue:12 Volume:9 Page:2499-2505
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hannila EsaORCID,Augustine Bobins,Kurkela TimoORCID,Lauri JanneORCID,Fabritius TapioORCID

Funder

Business Finland Funded Project

Academy of Finland

European Regional Development Fund

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A hybrid DMAIC framework for integrating response surface methodology and multi-objective optimization methods;The International Journal of Advanced Manufacturing Technology;2022-09-22

2. Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-02

3. Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics;IEEE Transactions on Instrumentation and Measurement;2021

4. The Effect of Torsional Bending on Reliability and Lifetime of Printed Silver Conductors;IEEE Transactions on Electron Devices;2020-06

5. Non-Contact Characterization of Flexible Hybrid Electronics by Synchronized Thermography;IEEE Transactions on Instrumentation and Measurement;2020-05
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