Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods-Reference-Cited by-同舟云学术

Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods

Published:2023-03 Issue:3 Volume:13 Page:346-355
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Cao Zhibo¹^ORCID,Stocchi Matteo¹,Wietstruck Matthias¹^ORCID,Mausolf Thomas²,Carta Corrado²,Kaynak Mehmet¹

Affiliation:

1. Department of Technology, IHP–Leibniz-Institut fur Innovative Mikroelektronik, Frankfurt Oder, Germany

2. Department of Circuit Design, IHP–Leibniz-Institut fur Innovative Mikroelektronik, Frankfurt Oder, Germany

Funder

Federal Ministry of Education and Research (BMBF, Germany) as part of the project HyTeck “Hybridintegrationsplattform für zuverlassige Hochfrequenz-Schaltkreise”

European Union’s Horizon 2020 Program FLEXCOM “FLEXible phased array system for sat-COM applications”

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10115315/10076425.pdf?arnumber=10076425

Reference18 articles.

1. An integrated micro cooling system for electronic circuits

2. Thermal Considerations of a Power Converter With Components Embedded in Printed Circuit Boards

3. Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

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