Improving Impact Toughness of BGA Lead-Free Solder Joints by Using Higher Current Density in Electrolytic Ni Plating
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Published:2011-01
Issue:1
Volume:1
Page:16-24
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ISSN:2156-3950
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Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
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language:
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Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Yamamoto Kenichi,Kawamura Toshinori,Nakano Hiroshi,Akahoshi Haruo,Satoh Ryohei
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials