Broadband Duplex–Filtenna Based on Low-Profile Metallic Cavity Packaging-Reference-Cited by-同舟云学术

Broadband Duplex–Filtenna Based on Low-Profile Metallic Cavity Packaging

Published:2018-08 Issue:8 Volume:8 Page:1451-1457
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zheng Bing-Long^ORCID,Wong Sai-Wai^ORCID,Zhu Lei^ORCID,He Yejun^ORCID

Funder

Fundamental Research Funds for the Central Universities

Shenzhen Science and Technology Programs

Guangdong Science and Technology Department

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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