Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards-Reference-Cited by-同舟云学术

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Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards

Published:2014-05 Issue:5 Volume:4 Page:882-891
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhang Mu-Shui,Tan Hong-Zhou,Mao Jun-Fa

Funder

Program of Guangzhou Zhujiang Sci-Tech New Star

Sysung-Etri project

Guangdong Leaning-Research-Production Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/6810855/06709668.pdf?arnumber=6709668

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Application of Continued Fractions to Decoupling Capacitor Modeling in Multilayered Printed Circuits;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01

2. Modeling and Quantification for Electromagnetic Radiation of Power-Bus Structure With Multilayer Printed Circuit Board;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-01

3. A Novel Layer Stack-Up With Free Cavity Resonance for High-Performance Power Noise Suppression;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-12

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