Lens Forming by Stack Dispensing for LED Wafer Level Packaging

Author:

Rong Zhang ,Lee Shi-Wei Ricky,Lo Jeffery C. C.

Funder

Guangdong Provincial Department of Science and Technology through the Project entitled Development and Commercialization of LED Lighting Products Based on Integrated Comb Structure, Flip Chip Packaging with Embedded Cavity-Through Vias, and Miniaturized Long Service Life Power Supply Technologies the scheme of Provincial Strategic Emerging Industry Funds

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Die attachment, wire bonding, and encapsulation process in LED packaging: A review;Sensors and Actuators A: Physical;2021-10

2. An Efficient Process of Surface Modification and Patterning for LED Encapsulation;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-05

3. Compact Dual-LED Packaging With a 3-D Free-Form Lens for Uniform Rectangular Illumination;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-04

4. Fabrication of Lens With Large View Angle Through Droplet Evaporation for High-Power Light-Emitting Diodes;Journal of Display Technology;2016-03

5. Fabrication of adjustable-morphology lens based on electrohydrodynamic for high-power light-emitting diodes;Journal of Micromechanics and Microengineering;2015-08-18

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