A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages
Author:
Affiliation:
1. School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA
2. Texas Instruments, Inc., Dallas, TX, USA
Funder
Semiconductor Research Corporation
Texas Instruments
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/9743783/09706464.pdf?arnumber=9706464
Reference26 articles.
1. Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading
2. Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface Tractions
3. Elastic Fracture Mechanics Concepts for Interfacial Cracks
4. A study of multiple singularities in multi-material wedges and their use in analysis of microelectronic interconnect structures
5. Thermal stresses in aluminum lines bounded to substrates
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1. Cracking in semiconductor devices–effect of plasticity under triaxial constraint;Journal of the Mechanics and Physics of Solids;2024-09
2. Multi-material Corner Singularity in Electronic Packaging: Avoiding Mesh Dependence in Analyzing Stress;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Shift of die passivation by ratcheting of underlying aluminum bond pads;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
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