Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures
Author:
Affiliation:
1. Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Hong Kong, SAR, China
Funder
The Hong Kong University of Science and Technology
HKUST-SJTU Joint Research Collaboration
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/9765761/09729846.pdf?arnumber=9729846
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4. Thermal Spreading Resistance in Ballistic-Diffusive Regime for GaN HEMTs
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