Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane-Reference-Cited by-同舟云学术

Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane

Published:2022-10 Issue:10 Volume:12 Page:1692-1701
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ouyang Guangqi¹^ORCID,Hanna Amir¹,Benedict Samatha¹,Ezhilarasu Goutham¹,Alam Arsalan¹,Irwin Randall W.¹,Iyer Subramanian S.¹^ORCID

Affiliation:

1. Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS), University of California at Los Angeles, Los Angeles, CA, USA

Funder

Semiconductor Research Corporation

Army Research Laboratory

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference18 articles.

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