Detailed Study of Optical and Thermal Performance for White Light-Emitting Diodes With Filament-Like Packaging Structures
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Published:2020-12
Issue:12
Volume:10
Page:2018-2026
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ISSN:2156-3950
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Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
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language:
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Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Liang Guanwei,
Tang YongORCID,
Lu Zhou,
Wu Kejian,
Li ZongtaoORCID,
Li JiashengORCID
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province
Fundamental Research Funds for the Central Universities
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials