Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Thickness Effect of Copper Clips on Power Module Packaging Design;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
2. High Temperature Lead‐Free Bonding Materials – The Need, the Potential Candidates and the Challenges;Lead‐free Soldering Process Development and Reliability;2020-07-03
3. Multiphysics Characterization of a Novel SiC Power Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-03
4. A Brief Review on High-Temperature, Pb-Free Die-Attach Materials;Journal of Electronic Materials;2018-10-08