Author:
Konoza Anthony,Sandborn Peter A.,Chaloupka Andrew C.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Numerical Simulation of Harmonic Response Analysis for Small Out-Line Package;2024 Asia-Pacific Conference on Software Engineering, Social Network Analysis and Intelligent Computing (SSAIC);2024-01-10
2. The Thermal–Structural Analysis of a Pin Under High Accelerated Stress Screening Test;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-09
3. Materials and Processes;SPRINGER-PRAX BOOKS;2016