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Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

  • Published:2014-10 Issue:10 Volume:4 Page:1613-1623
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Iachello Marco,De Luca Viviana,Petrone Giuseppe,Testa Natale,Fortuna Luigi,Cammarata Giuliano,Graziani Salvatore,Frasca Mattia

Funder

Ambition Power-Ricerca Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of a steady state electrothermal cosimulation model of SiC power modules;International Journal of Heat and Mass Transfer;2024-07

2. Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules;Case Studies in Thermal Engineering;2023-12

3. Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications;2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE);2023-07-17

4. Thermal Imbalance Among Paralleling Chips in Power Modules and the Impact From Traction Inverter System View;IEEE Transactions on Industrial Electronics;2023-03

5. Thermal neural networks: Lumped-parameter thermal modeling with state-space machine learning;Engineering Applications of Artificial Intelligence;2023-01
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