Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test
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Published:2011-11
Issue:11
Volume:1
Page:1747-1754
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ISSN:2156-3950
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Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
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language:
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Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Chang Hung-Jen,Chang Tao-Chih,Zhan Chau-Jie,Chou Jung-Hua
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials