Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate
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Published:2012-07
Issue:7
Volume:2
Page:1092-1098
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ISSN:2156-3950
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Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
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language:
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Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Smith Brian,Kwok Peter,Thompson Jeffrey,Mueller Andrew,Racz Livia
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials