Development of Embedded Redistribution Layer-Based Silicon Interposer for 3-D Integration-Reference-Cited by-同舟云学术

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Development of Embedded Redistribution Layer-Based Silicon Interposer for 3-D Integration

Published:2018-03 Issue:3 Volume:8 Page:399-409
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Qiu Yang^ORCID,Yue Shichao^ORCID,Moussa Walied A.^ORCID,Mousavi Pedram^ORCID

Funder

Alberta Innovative Technology Futures

Canadian National Science and Engineering Research Council

Alberta Government

CMC Microsystems

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/8320228/08299468.pdf?arnumber=8299468

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Self-Aligned Structure based on V-groove for Accurate Silicon Bridge Placement;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Conductive Polymer Metallized Vias: A New Approach for Substrate Integrated Waveguide Development;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-06

3. TSV Technology and High-Energy Heavy Ions Radiation Impact Review;Electronics;2018-07-13

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