Affiliation:
1. State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha, China
Funder
National Key Research and Development Program of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability;Microelectronic Engineering;2024-08
2. Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets;IEEE Transactions on Power Electronics;2024-08
3. Thermal resistance measurement and failure analysis of Multi-discrete SiC MOSFET System Module;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
4. Reliability Meta-modelling of Power Components;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
5. Physics-informed Machine Learning for Predicting Fatigue Damage of Wire Bonds in Power Electronic Modules;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07