Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets-Reference-Cited by-同舟云学术

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Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

Published:2011-07 Issue:7 Volume:1 Page:1064-1074
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Raghavan Sathyanarayanan,Klein Kevin,Yoon Samson,Kim Joong-Do,Moon Kyoung-Sik,Wong C. P.,Sitaraman Suresh K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/5958773/05778968.pdf?arnumber=5778968

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering;Journal of Electronic Materials;2024-08-01

2. Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on- Motherboard Assembly;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-12

4. Heating rate dependent delamination of metal–polymer interfaces: experiments and modeling;International Journal of Fracture;2014-03-19

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