A Fast Electrothermal Response Analysis Method for Interconnect Circuits With Multiexcitations in Multilayer Packages-Reference-Cited by-同舟云学术

A Fast Electrothermal Response Analysis Method for Interconnect Circuits With Multiexcitations in Multilayer Packages

Published:2023-07 Issue:7 Volume:13 Page:945-956
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Liu Yang¹^ORCID,Wu Dehang¹^ORCID,Xu Zhifei²,Chu Xiuqin¹^ORCID,Wang Jun¹^ORCID,Xu Kai-Da³^ORCID

Affiliation:

1. Key Laboratory of High Speed Circuit Design and EMC of Ministry of Education, School of Electronic Engineering, Xidian University, Xi’an, China

2. High Speed Platform Department, Ningbo Detoolic Technology Company Ltd., Ningbo, China

3. School of Information and Communications Engineering, Xi’an Jiaotong University, Xi’an, China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Natural Science Basic Research Program of Shaanxi Province

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference35 articles.