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Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

  • Published:2017-10 Issue:10 Volume:7 Page:1721-1728
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hou FengzeORCID,Lin Tingyu,Cao Liqiang,Liu Fengman,Li Jun,Fan XuejunORCID,Zhang G. Q.

Funder

National High-Tech R&D Program (863 Program)

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 42 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite element modeling and analysis method for predicting and optimizing the warpage of construction before flip chip bonding in System-on-Wafer process flow;Microelectronics Reliability;2023-12

2. Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

3. Combining Process Modeling and Machine Learning Technology to Predict the Warpage of the Panel-Level Packaging After Debonding;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

4. Analysis of Panel Warping for multilayer RDL Process and Extraction of Dielectric Properties of Photosensitive Polyimide on Fan-out Panel Level Packaging;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

5. Analysis and Modeling of Thermo mechanical Deformations and Stresses in Redistribution Layers in the Fan-out Wafer Level Packaging;2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME);2023-07-19
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