Systematic Design of Bandstop Power Distribution Network Using Resonant Vias
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Published:2015-04
Issue:4
Volume:5
Page:523-531
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ISSN:2156-3950
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Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
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language:
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Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Shih-Hsien Wu ,Yen-Wei Chen ,Yo-Shen Lin
Funder
National Science Council of Taiwan
National Center for High-Performance Computing, Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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