The Finite Element Model of the Effect of the Interface Behavior of Corner Bond on the Reliability of the BGA Package under Thermal Cycling-Reference-Cited by-同舟云学术

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The Finite Element Model of the Effect of the Interface Behavior of Corner Bond on the Reliability of the BGA Package under Thermal Cycling

Published:2020-08 Issue: Volume: Page:
ISSN:
Container-title:2020 21st International Conference on Electronic Packaging Technology (ICEPT)
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Author:

ZHANG Yonglin,CHEN Haibin,XUE Ke,YANG Jinglei,WU Jingshen

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9199379/9201905/09202588.pdf?arnumber=9202588

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. One-flow multi-step synthesis of a monomer as a precursor of thermal-conductive semiconductor packaging polymer via multi-phasic separation;Journal of Industrial and Engineering Chemistry;2023-07

2. Effects of Corner/Edge Bond and Side-fill for Automotive MCM Applications;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

3. Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly;Journal of Mechanical Engineering and Sciences;2022-03-23

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