Passive parametric modeling of interconnects and packaging components from sampled impedance, admittance or scattering data

Author:

Triverio Piero,Nakhla Michel,Grivet-Talocia Stefano

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Equivalent Circuit and Parasitic Parameter Extraction of 3D comb-like Redistribution Layer Applied for FOWLP;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. Passive Parametric Macromodeling by Using Sylvester State-Space Realizations;Informatics in Control, Automation and Robotics;2014-11-05

3. Parametric macromodeling forS-parameter data based on internal nonexpansivity;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2012-02-24

4. Gradient-based optimization using parametric sensitivity macromodels;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2012-01-20

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