Author:
Blecha Tomas,Pihera Josef
Cited by
3 articles.
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1. Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Noninvasive in Situ Monitoring for Compound Material Production Using Low Cost Foil Sensors;2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON);2023-12-05
3. Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17