Author:
Pufall R.,Goroll M.,Reuther G. M.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of an Innovative Leadframe Design for Eliminating Lead Delamination;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07