Practical application of laser soldering in electronics assembly-Reference-Cited by-同舟云学术

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Practical application of laser soldering in electronics assembly

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Container-title:ISIE '97 Proceeding of the IEEE International Symposium on Industrial Electronics
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Author:

Beckett P.M.,Fleming A.R.,Gilbert J.M.,Whitehead D.G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5230/14218/00651791.pdf?arnumber=651791

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced Temporal Pulse Shape Control for Laser Soldering Application Based on Commercial CW 450 nm Diode Lasers;Lasers in Manufacturing and Materials Processing;2023-12-27

2. Design and Performance Analysis of High-Precision Infrared Temperature Measurement Device Based on Butterworth Filter for Laser Soft Soldering;2023 5th International Conference on Intelligent Control, Measurement and Signal Processing (ICMSP);2023-05-19

3. A review: effect of copper percentage solder alloy after laser soldering;Soldering & Surface Mount Technology;2022-12-01

4. Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation;Journal of Electronic Packaging;2022-04-22

5. Flip-chip bonding of InP die on SiN-based TriPleX carrier with novel laser soldering;IEEE Journal of Quantum Electronics;2022

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