Research on Field Strength Optimization Method of High Voltage Semiconductor Packaging Based on Dielectric Functionally Graded Materials-Reference-Cited by-同舟云学术

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Research on Field Strength Optimization Method of High Voltage Semiconductor Packaging Based on Dielectric Functionally Graded Materials

Published:2022-09-25 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)
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Author:

Yao Huanmin¹,Mu Haibao¹,Li Wendong¹,Shao Xianjun²,Chen Xiaoxin²,Zhan Jiangyang²

Affiliation:

1. Xi'an Jiaotong University,State Key Laboratory of Electrical Insulation and Power Equipment,Xi'an,Shanxi,China

2. State Grid Zhejiang Electric Power Research Institute,Hangzhou,Zhejiang,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9961325/9961221/09961625.pdf?arnumber=9961625

Reference6 articles.

1. In situ electric field driven assembly to construct adaptive graded permittivity BaTiO3/epoxy resin composites for improved insulation performance

2. Desired Properties of a Nonlinear Resistive Coating for Shielding Triple Point in a Medium-Voltage Power Module

3. Field Grading Composites Tailored by Electrophoresis — Part 1: Principle and Permittivity Gradient in Uniform Electric Field

4. Electrical treeing in silicone gel under repetitive voltage impulses

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Two-Stage Electric Field Optimization Method for High-Voltage Power Module Using Dielectrically Graded Insulation Micro-Region;IEEE Transactions on Dielectrics and Electrical Insulation;2023-06

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