Study on the curing kinetics of an epoxy encapsulant by DSC method
Author:
Affiliation:
1. Institute of Electronic Engineering, China Academy of Engineering Physics,Mianyang,China,621900
2. School of Materials Science and Engineering, Wuhan University of Technology,Wuhan,China,430070
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9961325/9961221/09961350.pdf?arnumber=9961350
Reference10 articles.
1. Numerical Simulation on Cure Behavior and Optimization on Cure Cycle for Encapsulation Structure of Epoxy Resin;li;Acta Materiae Compositae Sinica,2021
2. Mechanisms generating residual stresses and distortion during manufacture of polymer–matrix composite structures
3. Study on curing kinetics of diallyl-bearing epoxy resin using sulfur as curing agent
4. Kinetic Analysis of Non-Isothermal Calorimetric Data;málek;Scientific papers of the University of Pardubice series B,1996
5. Kinetic studies of thermoset cure reactions: A review
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