Author:
Hoe T.M.,Tan S.Y.,Ng K.K.
Cited by
2 articles.
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1. Thermal Analysis of Active Electronic Component with Thermal Imaging;Proceedings of the Second International Conference on Information and Communication Technology for Competitive Strategies - ICTCS '16;2016
2. Investigation of factors affecting backside hotspot localization in infrared lock-in thermography;Journal of Micro/Nanolithography, MEMS, and MOEMS;2015-09-03