Author:
Zhang Haus,Tian Power,Qian Xuejian,Wang Winter
Cited by
3 articles.
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1. Integration of Soft Defect Localization (SDL) and Electro-Optical Probing (EOP) in Root Cause Investigation for Time Delay Related Issue;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
2. Defect Finding for Power-Related Failure Due to Internal Circuitry Issue;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
3. Application of Optical Techniques to Hardware Assurance;Emerging Topics in Hardware Security;2020-11-10