From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging-Reference-Cited by-同舟云学术

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From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging

Published:2018-07 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Author:

Hartfield Cheryl,Schmidt Christian,Gu Allen,Kelly Stephen T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8443568/8452167/08452551.pdf?arnumber=8452551

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Assessing Electronics with Advanced 3D X-ray Imaging Techniques, Nanoscale Tomography, and Deep Learning;Journal of Failure Analysis and Prevention;2024-08-09

2. Fast in-line failure analysis of sub-micron-sized cracks in 3D interconnect technologies utilizing acoustic interferometry;Communications Engineering;2024-07-19

3. Demystifying Edge Cases in Advanced IC Packaging Inspection through Novel Explainable AI Metrics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. A Special Holding System for Large Package in 3D X-Ray Inspection;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

5. Exploring the infiltrative and degradative ability of Fusarium oxysporum on polyethylene terephthalate (PET) using correlative microscopy and deep learning;Scientific Reports;2023-12-27

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