Author:
Gambino J. P.,Malinowski J.,Cote A.,Guthrie B.,Chapman P.,Vize A.,Bowe W.,Griffin C.,Cooney E.,Aoki T.,Chen Y.,Wang D.,Jaffe M.
Cited by
1 articles.
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1. Source Pad Design Tradeoffs for a Power TrenchFET;IEEE Transactions on Semiconductor Manufacturing;2022-08