The promise and implementation of three dimensional integration
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Published:2009-04
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Container-title:2009 International Symposium on VLSI Technology, Systems, and Applications
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Cited by
2 articles.
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1. How^|^rsquo;s Importance of Three-dimensional Packaging;Journal of The Japan Institute of Electronics Packaging;2013
2. Consideration for Main Application Constructed by 3D-TSV Technology;Journal of Japan Institute of Electronics Packaging;2012