AIM Photonics Demonstration of a 300 mm Si Photonics Interposer
Author:
Affiliation:
1. The Research Foundation for State University of New York, State University of New York Polytechnic Institute,Albany,NY,USA
2. Analog Photonics,Boston,MA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195394.pdf?arnumber=10195394
Reference15 articles.
1. Heterogeneous Integration of III-V Lasers in a 300 mm CMOS Manufacturing Line;baranowski;55th International Symposium on Microelectronics,2022
2. The AIM Photonics MPW: A Highly Accessible Cutting Edge Technology for Rapid Prototyping of Photonic Integrated Circuits
3. Dielectric Materials Characterization for Hybrid Bonding
4. Bonding of silicon wafers for silicon‐on‐insulator
5. Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection
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