Modeling Grain Size Effects on Deformation Behavior of SAC Solder Joints
Author:
Affiliation:
1. Auburn University,Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3),Department of Mechanical Engineering,Auburn,AL,36849
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195426.pdf?arnumber=10195426
Reference20 articles.
1. Investigating the effect of defects on the crack initiation of additively manufactured IN718 using crystal plasticity simulations;nandi;2022 International Solid Freeform Fabrication Symposium,2022
2. The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints
3. DAMASK – The Düsseldorf Advanced Material Simulation Kit for modeling multi-physics crystal plasticity, thermal, and damage phenomena from the single crystal up to the component scale
4. Elastic Constants of ? Tin from 4.2 K to 300 K;rayne;Physical Review 120,1960
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1. A Data-Driven Machine Learning Model for the Stress-Strain Behavior of Single Grain SAC305 Solder Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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