Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (IMC) on Interconnect Reliability-Reference-Cited by-同舟云学术

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Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (IMC) on Interconnect Reliability

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Ginga Nicholas J.¹^ORCID,Chen Rui²^ORCID,Sitaraman Suresh K.²

Affiliation:

1. University of Alabama in Huntsville, Mechanical and Aerospace Engineering,Huntsville,Alabama,USA

2. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology,Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab,Atlanta,Georgia,USA

Funder

Semiconductor Research Corporation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195435.pdf?arnumber=10195435

Reference15 articles.

1. Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

2. Cohesive fracture measurement technique for free-hanging thin films using highly stressed superlayer

3. Silicon and Nanoscale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods

4. Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies

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