Warpage Estimation of Panel-Level Package from Panel to Strip by Using Multi-Scaling Sub-modeling Technique
Author:
Affiliation:
1. National Tsing Hua University,Hsinchu,Taiwan, R.O.C
2. Industrial Technology Research Institute,Hsinchu,Taiwan
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195774.pdf?arnumber=10195774
Reference8 articles.
1. A Multi-point constraints based integrated layout and topology optimization design of multi-component systems
2. Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging
3. Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling
4. Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging
5. Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging
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