Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations-Reference-Cited by-同舟云学术

Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Sherwood Tyler¹,Patlolla Raghuveer¹,Salfelder Joe¹,Kasbauer Thomas²,Sreenivasan Raghav³,Li Kun¹,Ley Ryan³,Probst Gernot²,Appell Jason¹,Ahn Ki Cheol¹,Gorchichko Masha³,Uhrmann Thomas²

Affiliation:

1. Applied Materials,Albany,NY,USA

2. EV Group,St. Florian am Inn,Austria

3. Applied Materials,Santa Clara,CA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195528.pdf?arnumber=10195528

Reference5 articles.

1. Cu Microstructure of High Density Cu Hybrid Bonding Interconnection

2. Dielectric Materials Characterization for Hybrid Bonding

3. Impacts of Misalignment on 1μm Pitch Cu-Cu Hybrid Bonding

4. 3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes

5. The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking

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