Electrospray Printing of Polymeric and Metallic Coatings for Electronics Packaging
Author:
Affiliation:
1. State University of New York,Department of Mechanical Engineering,Binghamton New York,USA
Funder
Semiconductor Research Corporation (SRC)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195603.pdf?arnumber=10195603
Reference28 articles.
1. Review on the physics of electrospray: From electrokinetics to the operating conditions of single and coaxial Taylor cone-jets, and AC electrospray
2. Self-Limiting Electrospray Deposition for the Surface Modification of Additively Manufactured Parts
3. Electrospray application to powder production and surface coating
4. Electrospray: More than just an ionization source
5. Electrosprays in the cone-jet mode: From Taylor cone formation to spray development
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