Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning-Reference-Cited by-同舟云学术

Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Pahwa Ramanpreet Singh¹,Chang Richard¹,Jie Wang¹,Xun Xu¹,Zaw Min Oo¹,Sheng Foo Chuan¹,Ser Choong Chong²,Rao Vempati Srinivasa²

Affiliation:

1. A*STAR,Institute for Infocomm Research (I2R),Singapore

2. A*STAR,Institute of Microelectronics (IME),Singapore

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816525.pdf?arnumber=9816525

Reference30 articles.

1. Deep Learning Analysis of 3D X-ray Images for Automated Object Detection and Attribute Measurement of Buried Package Features

2. Mixmatch: A holistic approach to semi-supervised learning;berthelot;Advances in neural information processing systems,2019

3. Tangent-normal adversarial regularization for semi-supervised learning;yu;CoRR,2018

4. Cutmix: Regularization strategy to train strong classifiers with localizable features;yun;Proceedings of the IEEE/CVF International Conference on Computer Vision,2019

5. FeatMatch: Feature-Based Augmentation for Semi-supervised Learning

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