A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding-Reference-Cited by-同舟云学术

A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Shin Jiwon¹,Woo Kwangbok¹,Kwon Donguk¹,Kim Youngja¹,Lee Youngmin¹,Kang Dongwoo¹,Sahoo Krutikesh²,Ren Haoxiang²,Huang Yu-Pei²,Shah Ujash²,Yang Yutao²,Kuchhangi Ankit²,Iyer Subramanian S.²

Affiliation:

1. Samsung Electronics,Package Process Development Team Test and System Package,Asan,South Korea

2. UCLA,Center for Heterogeneous Integration and Performance Scaling (CHIPS),Los Angeles,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816580.pdf?arnumber=9816580

Reference9 articles.

1. Modeling of self-alignment mechanism in flip-chip soldering. II. Multichip solder joints

2. Design of solder joints for self-aligned optoelectronic assemblies

3. Yield prediction for flip-chip solder assemblies based on solder shape modeling

4. Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

5. Self aligned, flip chip assembly of photonic devices with electrical and optical connections

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

2. Thermal Reflow Simulation for PMMA Structures with Nonuniform Viscosity Profile;Polymers;2023-09-11