Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications-Reference-Cited by-同舟云学术

Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Lee Tzu Nien¹,Lau John H¹,Ko Cheng-Ta¹,Xia Tim¹,Lin Eagle¹,Yang Kai-Ming¹,Lin Puru Bruce¹,Peng Chia-Yu¹,Chang Leo¹,Chen Jia Shiang¹,Fang Yi-Hsiu¹,Liao Li-Yueh¹,Charn Edward¹,Wang Jason¹,Tseng Tzyy-Jang¹

Affiliation:

1. Unimicron Technology Corporation,Taoyuan City,Taiwan,33341

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816523.pdf?arnumber=9816523

Reference20 articles.

1. Low Permittivity and Dielectric Loss Polyimide with Patternability for High Frequency Applications

2. Low Temperature Curable Low Df Photosensitive Polyimide;tomikawa;Proc of the International Symposium on Microelectronics,2019

3. Hsigh Frequency Dielectric Properties of Low Dk, Df Polyimides;tomikawa;Proc of the International Symposium on Microelectronics,2020

4. Complex Permittivity Measurements in a Wide Temperature Range for Printed Circuit Board Material Used in Millimeter Wave Band

5. Novel Low Temperature Curable Photo-Patternable Low Dk/Df for Wafer Level Packaging (WLP)

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